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The effect of transition layer on the strength of nanotwinn..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Zhong-Guo
;
Gao, Li-Yin
;
Liu, Zhi-Quan
- p. 1-3 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202918
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>The effect of transition layer on the strength of nanotwinned copper film by DC electrodeposition</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202918&Exemplar=1&LAN=DE A1 Li, Zhong-Guo A1 Gao, Li-Yin A1 Liu, Zhi-Quan YR 2020 K1 Copper K1 Substrates K1 Scanning electron microscopy K1 Electronics packaging K1 Anodes K1 Cathodes K1 Crystals K1 nanotwinned copper K1 transition layer K1 direct current electrodeposition K1 tensile strength SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202918 DO https://doi.org/10.1109/ICEPT50128.2020.9202918 SF ELIB - SuUB Bremen
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