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1 Ergebnisse
1
Effect of Magnetic Field on Microstructure and Properties o..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Xu, Hongbo
;
Zhang, Xuchao
;
Zhao, Hongyun
. - p. 1-3 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202929
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Effect of Magnetic Field on Microstructure and Properties of Smart Solder</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202929&Exemplar=1&LAN=DE A1 Xu, Hongbo A1 Zhang, Xuchao A1 Zhao, Hongyun A1 Li, Mingyu YR 2020 K1 Nickel K1 Magnetic fields K1 Soldering K1 Morphology K1 Magnetosphere K1 Through-silicon vias K1 Electronics packaging K1 magnetic field K1 soldering K1 smart solder K1 IMC SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202929 DO https://doi.org/10.1109/ICEPT50128.2020.9202929 SF ELIB - SuUB Bremen
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