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Stress behavior of solder joint in PET based chip for heter..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Jo, Eunsol ; Jung, Cheong-Ha ; Kim, Gu-Sung - p. 1-3 , 2020
Link: https://doi.org/10.1109/ICEPT50128.2020.9202967