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Influence of Bump Diameter on the Growth of Intermetallic C..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Ma, Mingbiao ; Ren, Siru ; Wang, Jing.. - p. 1-4 , 2020
Link: https://doi.org/10.1109/ICEPT50128.2020.9202971