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1 Ergebnisse
1
Effect of Ag content on microstructure and fatigue crack of..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Cao, Huadong
;
Gan, Guisheng
;
Tian, Mizhe
... - p. 1-6 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202979
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Effect of Ag content on microstructure and fatigue crack of SAC lead-free solder balls under rapid thermal fatigue</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202979&Exemplar=1&LAN=DE A1 Cao, Huadong A1 Gan, Guisheng A1 Tian, Mizhe A1 Jiang, Liujie A1 Liu, Cong A1 Zhang, Chunhong A1 Sun, Pengfei A1 Liu, Xin A1 Wu, Yiping YR 2020 K1 Microstructure K1 Surface cracks K1 Fatigue K1 Lead K1 Heating systems K1 Thermal stresses K1 Ag content K1 microstructure evolution K1 cracks K1 rapid thermal fatigue SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202979 DO https://doi.org/10.1109/ICEPT50128.2020.9202979 SF ELIB - SuUB Bremen
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