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1 Ergebnisse
1
Resistive Failure Localization of Electronic Components by ..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Chen, Xuanlong
;
Li, Enliang
;
Cai, Jinbao
... - p. 1-4 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202980
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Resistive Failure Localization of Electronic Components by Lock-in Thermography</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202980&Exemplar=1&LAN=DE A1 Chen, Xuanlong A1 Li, Enliang A1 Cai, Jinbao A1 Feng, Liting A1 Xia, Xingxian A1 Ni, Yiqiang YR 2020 K1 Failure analysis K1 Circuit faults K1 Resistance K1 Heating systems K1 Reliability K1 Microscopy K1 lock-in thermography K1 failure localization K1 MLCC K1 passive component K1 infrared thermography SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202980 DO https://doi.org/10.1109/ICEPT50128.2020.9202980 SF ELIB - SuUB Bremen
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