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1 Ergebnisse
1
Supplier Selection for High Temperature Die Attach by hybri..:
, In:
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
,
Wakeel, Saif
;
Ahmad, Shafi
;
Bingol, Sedat
... - p. 1-5 , 2020
Link:
https://doi.org/10.1109/ICEPT50128.2020.9202994
RT T1 <cTitle>2020 21st International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Supplier Selection for High Temperature Die Attach by hybrid Entropy-Range of Value MCDM Technique: A Semiconductor Industry</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9202994&Exemplar=1&LAN=DE A1 Wakeel, Saif A1 Ahmad, Shafi A1 Bingol, Sedat A1 Bashir, M. Nasir A1 Pacal, Tugce Cemre A1 Khan, Zahid Akhtar YR 2020 K1 Entropy K1 Microassembly K1 Electronics industry K1 Information entropy K1 Conductivity K1 Metals K1 Thermal conductivity K1 High temperature die attach material (HTDM) K1 Silver sintered paste (Ag Paste) K1 Entropy-range of value method K1 MCDM K1 sensitivity analysis SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT50128.2020.9202994 DO https://doi.org/10.1109/ICEPT50128.2020.9202994 SF ELIB - SuUB Bremen
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