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Thermal performance analysis of a package using non-simulat..:

, In: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Chien, Heng-Chieh ; Huang, Mei-Jiau ; Chen, Zheng-Zhun - p. 76-77 , 2020
Link: https://doi.org/10.1109/VLSI-TSA48913.2020.9203733