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Temperature Evolution as an effect of Wire-bond Failures in..:

, In: 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe),
Degrenne, N. ; Delamea, R. ; Mollov, S. - p. P.1-P.8 , 2020
Link: https://doi.org/10.23919/EPE20ECCEEurope43536.2020.921..