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1 Ergebnisse
1
Temperature-Aware Compact Modeling for Resistivity in Ultra..:
, In:
2020 IEEE 24th Workshop on Signal and Power Integrity (SPI)
,
Kumar, Rahul
;
Kumar, Somesh
;
Guglani, Surila
... - p. 1-4 , 2020
Link:
https://doi.org/10.1109/SPI48784.2020.9218199
RT T1 <cTitle>2020 IEEE 24th Workshop on Signal and Power Integrity (SPI)</cTitle>: T1 <Title>Temperature-Aware Compact Modeling for Resistivity in Ultra-Scaled Cu-Graphene Hybrid Interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9218199&Exemplar=1&LAN=DE A1 Kumar, Rahul A1 Kumar, Somesh A1 Guglani, Surila A1 Roy, Sourajeet A1 Kaushik, Brajesh K. A1 Sharma, Rohit A1 Achar, Ramachandra YR 2020 K1 Conductivity K1 Graphene K1 Rough surfaces K1 Surface roughness K1 Surface resistance K1 Scattering K1 Copper K1 resistivity K1 graphene K1 surface roughness K1 on-chip interconnects K1 temperature SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/SPI48784.2020.9218199 DO https://doi.org/10.1109/SPI48784.2020.9218199 SF ELIB - SuUB Bremen
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