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1 Ergebnisse
1
Tooling and procedures for hybrid integration of lasers by ..:
, In:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
,
Mitchell, Colin J
;
Li, Ke
;
Schachler, Ralph
... - p. 1-7 , 2020
Link:
https://doi.org/10.1109/ESTC48849.2020.9229661
RT T1
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
: T1
Tooling and procedures for hybrid integration of lasers by flip-chip technology
UL https://suche.suub.uni-bremen.de/peid=ieee-9229661&Exemplar=1&LAN=DE A1 Mitchell, Colin J A1 Li, Ke A1 Schachler, Ralph A1 Khokhar, Ali A1 Chen, Xia A1 Stankovic, Stevan A1 Wang, Xiangjun A1 Sessions, Neil P A1 Grabska, Katarzyna M A1 Thomson, David J A1 Daedlow, Christoph A1 Reed, Graham T A1 Wilkinson, James S YR 2020 K1 laser K1 integration K1 hybrid K1 flip-chip K1 passive alignment K1 silicon photonics SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/ESTC48849.2020.9229661 DO https://doi.org/10.1109/ESTC48849.2020.9229661 SF ELIB - SuUB Bremen
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