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1 Ergebnisse
1
Cu pillar based Advanced Packaging, for large area & fine p..:
, In:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
,
MANI, Abdenacer AIT
;
CAICEDO, Nohora
;
MILOUD-ALI, Nadia
... - p. 1-6 , 2020
Link:
https://doi.org/10.1109/ESTC48849.2020.9229685
RT T1 <cTitle>2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)</cTitle>: T1 <Title>Cu pillar based Advanced Packaging, for large area & fine pitch heterogeneous devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9229685&Exemplar=1&LAN=DE A1 MANI, Abdenacer AIT A1 CAICEDO, Nohora A1 MILOUD-ALI, Nadia A1 LEVY, Francois A1 BERGER, Frederic A1 MOURIER, Thierry A1 CHAIRA, Tarik A1 APHOZ, Natacha R A1 BEDOIN, Alexis A1 PERAY, Patrick A1 FRANCOU, Mireille A1 GUEUGNOT, Alain A1 BOUTAFA, Laura A1 HENRY, David YR 2020 K1 Packaging K1 Cu pillars K1 Solder K1 Bow K1 Hybridization K1 Interconnections K1 PV (Peak to Valley) K1 Underfilling SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ESTC48849.2020.9229685 DO https://doi.org/10.1109/ESTC48849.2020.9229685 SF ELIB - SuUB Bremen
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