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Investigations on passive Temperature-Cycling Robustness of..:
, In:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
,
Klemm, Alexander
;
Schmidt, Michael
;
Rittner, Martin
... - p. 1-5 , 2020
Link:
https://doi.org/10.1109/ESTC48849.2020.9229700
RT T1 <cTitle>2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)</cTitle>: T1 <Title>Investigations on passive Temperature-Cycling Robustness of novel Interconnection Element for low-inductive Power Modules</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9229700&Exemplar=1&LAN=DE A1 Klemm, Alexander A1 Schmidt, Michael A1 Rittner, Martin A1 Guyenot, Michael A1 Reinold, Manfred A1 Holz, Rainer A1 Kessler, Ulrich YR 2020 K1 power module K1 power module design K1 AlCu K1 ribbon bonds K1 thermal shock test K1 solder joints K1 reliability SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ESTC48849.2020.9229700 DO https://doi.org/10.1109/ESTC48849.2020.9229700 SF ELIB - SuUB Bremen
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