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1
Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnec..:
, In:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
,
Panchenko, Iuliana
;
Wambera, Laura
;
Mueller, Maik
... - p. 1-7 , 2020
Link:
https://doi.org/10.1109/ESTC48849.2020.9229743
RT T1 <cTitle>2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)</cTitle>: T1 <Title>Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testing</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9229743&Exemplar=1&LAN=DE A1 Panchenko, Iuliana A1 Wambera, Laura A1 Mueller, Maik A1 Rudolph, Catharina A1 Hanisch, Anke A1 Bartusseck, Irene A1 Wolf, M. J. YR 2020 K1 hybrid bonding K1 wafer-to-wafer bonding K1 grain structure K1 EBSD K1 grain intergrowth K1 texture SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/ESTC48849.2020.9229743 DO https://doi.org/10.1109/ESTC48849.2020.9229743 SF ELIB - SuUB Bremen
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