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1 Ergebnisse
1
Bi Behaviour in Au–(In–Bi) SLID Bonding:
, In:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
,
Kuziora, Stephane Leonard
;
Nguyen, Hoang-Vu
;
Bolstad, Per Kristian
. - p. 1-5 , 2020
Link:
https://doi.org/10.1109/ESTC48849.2020.9229784
RT T1 <cTitle>2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)</cTitle>: T1 <Title>Bi Behaviour in Au–(In–Bi) SLID Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9229784&Exemplar=1&LAN=DE A1 Kuziora, Stephane Leonard A1 Nguyen, Hoang-Vu A1 Bolstad, Per Kristian A1 Aasmundtveit, Knut E. YR 2020 K1 Au–(In–Bi) K1 SLID K1 TLP K1 Bonding K1 Intermetallics SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ESTC48849.2020.9229784 DO https://doi.org/10.1109/ESTC48849.2020.9229784 SF ELIB - SuUB Bremen
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