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1 Ergebnisse
1
Process development and characterization of 3D multi-die st..:
, In:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
,
Gerets, Carine
;
Derakhshandeh, Jaber
;
Bex, Pieter
... - p. 1-6 , 2020
Link:
https://doi.org/10.1109/ESTC48849.2020.9229814
RT T1 <cTitle>2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)</cTitle>: T1 <Title>Process development and characterization of 3D multi-die stacking</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9229814&Exemplar=1&LAN=DE A1 Gerets, Carine A1 Derakhshandeh, Jaber A1 Bex, Pieter A1 Lofrano, Melina A1 Cherman, Vladimir A1 Fodor, Ferenc A1 De Wolf, Ingrid A1 Rebibis, Kenneth June A1 Beyer, Gerald A1 Miller, Andy A1 Beyne, Eric YR 2020 K1 Die to wafer K1 Sequential bonding K1 Vertical collective bonding K1 Multi-die stacking K1 TCB SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ESTC48849.2020.9229814 DO https://doi.org/10.1109/ESTC48849.2020.9229814 SF ELIB - SuUB Bremen
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