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Research On FOPLP Package of multi-chip Power Module:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Jiang, Jing ; Huo, Jia ren ; Song, Guan qiang... - p. 1-6 , 2020
Link: https://doi.org/10.1109/ESTC48849.2020.9229816