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1 Ergebnisse
1
Optimization of soldering experiments for power devices int..:
, In:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
,
BARIK, El Mostafa
;
GILLOT, Charlotte
;
HODAJ, Fiqiri
- p. 1-7 , 2020
Link:
https://doi.org/10.1109/ESTC48849.2020.9229817
RT T1
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
: T1
Optimization of soldering experiments for power devices interconnection and packaging
UL https://suche.suub.uni-bremen.de/peid=ieee-9229817&Exemplar=1&LAN=DE A1 BARIK, El Mostafa A1 GILLOT, Charlotte A1 HODAJ, Fiqiri YR 2020 K1 soldering K1 Cu/Sn-Ag bumps K1 solder thickness K1 joint porosities SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/ESTC48849.2020.9229817 DO https://doi.org/10.1109/ESTC48849.2020.9229817 SF ELIB - SuUB Bremen
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