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1 Ergebnisse
1
Co-integration of TSV mid process and optical devices for S..:
, In:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
,
Tissier, Pierre
;
Charbonnier, Jean
;
Velard, Remi
... - p. 1-5 , 2020
Link:
https://doi.org/10.1109/ESTC48849.2020.9229858
RT T1
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
: T1
Co-integration of TSV mid process and optical devices for Silicon photonics interposers
UL https://suche.suub.uni-bremen.de/peid=ieee-9229858&Exemplar=1&LAN=DE A1 Tissier, Pierre A1 Charbonnier, Jean A1 Velard, Remi A1 Ponthenier, Fabienne A1 Farcy, Alexis A1 Boeuf, Frederic A1 Bernabe, Stephane A1 Charbonnier, Benoit A1 Broquin, Jean-Emmanuel YR 2020 K1 photonics K1 interposer K1 silicon ring modulator K1 TSV Mid K1 thinning SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ESTC48849.2020.9229858 DO https://doi.org/10.1109/ESTC48849.2020.9229858 SF ELIB - SuUB Bremen
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