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1 Ergebnisse
1
LTCC Embedding of SiC Power Devices for High Temperature Ap..:
, In:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
,
Bayer, Benjamin
;
Groccia, Mario
;
Bach, Hoang Linh
... - p. 1-5 , 2020
Link:
https://doi.org/10.1109/ESTC48849.2020.9229859
RT T1
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
: T1
LTCC Embedding of SiC Power Devices for High Temperature Applications over 400 °C
UL https://suche.suub.uni-bremen.de/peid=ieee-9229859&Exemplar=1&LAN=DE A1 Bayer, Benjamin A1 Groccia, Mario A1 Bach, Hoang Linh A1 Friedrich Bayer, Christoph A1 Schletz, Andreas A1 Lenz, Christian A1 Ziesche, Steffen YR 2020 K1 High temperature packaging K1 LTCC K1 ceramic K1 embedding K1 wide-bandgap SiC K1 power devices K1 power modules SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ESTC48849.2020.9229859 DO https://doi.org/10.1109/ESTC48849.2020.9229859 SF ELIB - SuUB Bremen
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