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1 Ergebnisse
1
The Modelling of Stress Assessment Based on Solid State Ele..:
, In:
2020 2nd International Conference on Smart Power & Internet Energy Systems (SPIES)
,
Li, Hui-yao
;
Zhao, Wen-jie
;
Wang, Cheng-an
... - p. 49-54 , 2020
Link:
https://doi.org/10.1109/SPIES48661.2020.9243047
RT T1 <cTitle>2020 2nd International Conference on Smart Power & Internet Energy Systems (SPIES)</cTitle>: T1 <Title>The Modelling of Stress Assessment Based on Solid State Electronic Switch and Research on It's Safety Characteristics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9243047&Exemplar=1&LAN=DE A1 Li, Hui-yao A1 Zhao, Wen-jie A1 Wang, Cheng-an A1 Zhou, Xin-shun A1 Ji, Zhi-po A1 Zhang, Bo-lin YR 2020 K1 Semiconductor device modeling K1 Solid modeling K1 Temperature distribution K1 Power distribution K1 Switches K1 Transient analysis K1 Stress K1 PCDU K1 SSPC K1 Transient temperature rise K1 Power supply and distribution technology SP 49 OP 54 LK http://dx.doi.org/https://doi.org/10.1109/SPIES48661.2020.9243047 DO https://doi.org/10.1109/SPIES48661.2020.9243047 SF ELIB - SuUB Bremen
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