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1 Ergebnisse
1
Dual-Band 5G Antenna Array in Fan-Out Wafer-Level Packaging..:
, In:
2020 23rd International Microwave and Radar Conference (MIKON)
,
Le, Thi Huyen
;
Kanitkar, Abhijeet
;
Rossi, Marco
... - p. 157-161 , 2020
Link:
https://doi.org/10.23919/MIKON48703.2020.9253926
RT T1 <cTitle>2020 23rd International Microwave and Radar Conference (MIKON)</cTitle>: T1 <Title>Dual-Band 5G Antenna Array in Fan-Out Wafer-Level Packaging (FOWLP) Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9253926&Exemplar=1&LAN=DE A1 Le, Thi Huyen A1 Kanitkar, Abhijeet A1 Rossi, Marco A1 Ndip, Ivan A1 Braun, Tanja A1 Mueller, Friedrich A1 Lang, Klaus Dieter A1 Wieland, Marcel A1 Goetze, Christian A1 Halim, Saquib Bin A1 Trewhella, Jean YR 2020 K1 5G K1 mm-Wave K1 mobile communication K1 dual-band antenna array K1 packaging architectures K1 FOWLP K1 band-width K1 peak gain K1 efficiency K1 radiation pattern SP 157 OP 161 LK http://dx.doi.org/https://doi.org/10.23919/MIKON48703.2020.9253926 DO https://doi.org/10.23919/MIKON48703.2020.9253926 SF ELIB - SuUB Bremen
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