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FIB vs Cleaving Methods for Blanket Al Thickness Measuremen..:

, In: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Li, LiHong ; Lee, Sharon ; Khoo, Ley Hong.. - p. 1-4 , 2020
Link: https://doi.org/10.1109/IPFA49335.2020.9260593