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Multi-layered film stack models to simulate X-ray reflectiv..:
, In:
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Nistala, Ramesh Rao
;
Ong, Kenny
;
Wang, Yun
.. - p. 1-4 , 2020
Link:
https://doi.org/10.1109/IPFA49335.2020.9260634
RT T1
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
: T1
Multi-layered film stack models to simulate X-ray reflectivity of TaN and Ta thin films
UL https://suche.suub.uni-bremen.de/peid=ieee-9260634&Exemplar=1&LAN=DE A1 Nistala, Ramesh Rao A1 Ong, Kenny A1 Wang, Yun A1 Zhu, Xintong A1 Mo, Zhi Qiang YR 2020 SN 1946-1550 K1 Intensity modulation K1 High frequency K1 Data models K1 Reflectivity K1 Reflection K1 Argon K1 Metals K1 XRR K1 Ta/TaN barrier metal K1 film thickness K1 film density SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IPFA49335.2020.9260634 DO https://doi.org/10.1109/IPFA49335.2020.9260634 SF ELIB - SuUB Bremen
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