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1 Ergebnisse
1
Power Plane Defect Findings in Silicon with Lock- In Thermo..:
, In:
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Ng, C.Y.
;
Zamri, M.S. Muhamad
;
Ng, H.B.
... - p. 1-4 , 2020
Link:
https://doi.org/10.1109/IPFA49335.2020.9260895
RT T1
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
: T1
Power Plane Defect Findings in Silicon with Lock- In Thermography & OBIRCH/TIVA Techniques
UL https://suche.suub.uni-bremen.de/peid=ieee-9260895&Exemplar=1&LAN=DE A1 Ng, C.Y. A1 Zamri, M.S. Muhamad A1 Ng, H.B. A1 Ng, J.C. A1 Mazlan, S.A. A1 Chuah, W.H. A1 Ooi, Z.Y. A1 Ooi, Y.K. A1 Chen, S. YR 2020 SN 1946-1550 K1 Silicon K1 Lenses K1 Imaging K1 Semiconductor device measurement K1 Copper K1 Packaging K1 Failure analysis K1 lock-in thermography K1 OBIRCH K1 TIVA K1 fault isolation SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IPFA49335.2020.9260895 DO https://doi.org/10.1109/IPFA49335.2020.9260895 SF ELIB - SuUB Bremen
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