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1 Ergebnisse
1
Enabling UTBB Strained SOI Platform for Co-integration of L..:
, In:
2020 IEEE Symposium on VLSI Technology
,
Sun, Chen
;
Liang, Jie
;
Xu, Haiwen
... - p. 1-2 , 2020
Link:
https://doi.org/10.1109/VLSITechnology18217.2020.92650..
RT T1
2020 IEEE Symposium on VLSI Technology
: T1
Enabling UTBB Strained SOI Platform for Co-integration of Logic and RF: Implant-Induced Strain Relaxation and Comb-like Device Architecture
UL https://suche.suub.uni-bremen.de/peid=ieee-9265070&Exemplar=1&LAN=DE A1 Sun, Chen A1 Liang, Jie A1 Xu, Haiwen A1 Kong, Eugene A1 Nguyen, Bich-Yen A1 Vandooren, Anne A1 Schwarzenbach, Walter A1 Maleville, Christophe A1 Barral, Vincent A1 Berthelon, Remy A1 Weber, Olivier A1 Arnaud, Franck A1 Thean, Aaron V.-Y. A1 Gong, Xiao YR 2020 SN 2158-9682 K1 Silicon K1 Silicon germanium K1 Tensile strain K1 Germanium K1 Radio frequency K1 Annealing K1 Implants SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSITechnology18217.2020.9265070 DO https://doi.org/10.1109/VLSITechnology18217.2020.9265070 SF ELIB - SuUB Bremen
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