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1 Ergebnisse
1
Heterogeneous System-Level Package Integration - Trends and..:
, In:
2020 IEEE Symposium on VLSI Technology
,
Lee, Frank J.C.
;
Wong, Mei
;
Tzou, Jerry
... - p. 1-2 , 2020
Link:
https://doi.org/10.1109/VLSITechnology18217.2020.92650..
RT T1
2020 IEEE Symposium on VLSI Technology
: T1
Heterogeneous System-Level Package Integration - Trends and Challenges
UL https://suche.suub.uni-bremen.de/peid=ieee-9265085&Exemplar=1&LAN=DE A1 Lee, Frank J.C. A1 Wong, Mei A1 Tzou, Jerry A1 Yuan, Jonathan A1 Chang, Daniel A1 Rusu, Stefan YR 2020 SN 2158-9682 K1 Three-dimensional displays K1 Very large scale integration K1 Packaging K1 Capacitors K1 Silicon K1 Through-silicon vias K1 Program processors K1 package integration K1 system technology co-optimization K1 power delivery K1 cost reduction SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSITechnology18217.2020.9265085 DO https://doi.org/10.1109/VLSITechnology18217.2020.9265085 SF ELIB - SuUB Bremen
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