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1 Ergebnisse
1
Analysis of Underfill-Polymer Interfacial Adhesive Strength..:
, In:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Yeh, Shu-Shen
;
Lin, P. Y.
;
Hsu, C. K.
... - p. 1-4 , 2020
Link:
https://doi.org/10.1109/IMPACT50485.2020.9268535
RT T1 <cTitle>2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Analysis of Underfill-Polymer Interfacial Adhesive Strength by Combined Experimental and Modeling Approaches</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9268535&Exemplar=1&LAN=DE A1 Yeh, Shu-Shen A1 Lin, P. Y. A1 Hsu, C. K. A1 Lin, Y. S. A1 Wang, J. H. A1 Lai, P. C. A1 Liao, L. L. A1 Lee, T. Y. A1 Chen, C. H. A1 Yew, M. C. A1 Cheng, S. K. A1 Jeng, Shin-Puu YR 2020 SN 2150-5942 K1 Delamination K1 Strain K1 Adhesives K1 Loading K1 Finite element analysis K1 Stress K1 Silicon K1 interfacial adhesion strength K1 four-point bending test K1 strain K1 energy release rate K1 VCCT K1 finite element SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT50485.2020.9268535 DO https://doi.org/10.1109/IMPACT50485.2020.9268535 SF ELIB - SuUB Bremen
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