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1 Ergebnisse
1
Characteristics of Power Module with New Advanced Substrate:
, In:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Hsu, Hao Chiang
;
Cheng, Lu-Ken
;
Chi, Wei-Hao
. - p. 243-246 , 2020
Link:
https://doi.org/10.1109/IMPACT50485.2020.9268538
RT T1 <cTitle>2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Characteristics of Power Module with New Advanced Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9268538&Exemplar=1&LAN=DE A1 Hsu, Hao Chiang A1 Cheng, Lu-Ken A1 Chi, Wei-Hao A1 Liao, Hsueh-Kuo YR 2020 SN 2150-5942 K1 Thermal resistance K1 Substrates K1 Multichip modules K1 Temperature measurement K1 Thermal conductivity K1 Junctions K1 Copper SP 243 OP 246 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT50485.2020.9268538 DO https://doi.org/10.1109/IMPACT50485.2020.9268538 SF ELIB - SuUB Bremen
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