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Fabrication and Characterization of Wafer Level Three-Dimen..:
, In:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Hung, Ying-Tzu
;
Chang, Hsiang-Hung
;
Huang, Jian-Zhi
. - p. 125-128 , 2020
Link:
https://doi.org/10.1109/IMPACT50485.2020.9268541
RT T1
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
: T1
Fabrication and Characterization of Wafer Level Three-Dimensional Silicon Lens
UL https://suche.suub.uni-bremen.de/peid=ieee-9268541&Exemplar=1&LAN=DE A1 Hung, Ying-Tzu A1 Chang, Hsiang-Hung A1 Huang, Jian-Zhi A1 Chiang, Chia-Wen YR 2020 SN 2150-5942 K1 Silicon K1 Resists K1 Lenses K1 Etching K1 Microoptics K1 Gray-scale K1 Three-dimensional displays K1 silicon lens K1 reflow K1 reactive ion etching K1 wafer level process SP 125 OP 128 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT50485.2020.9268541 DO https://doi.org/10.1109/IMPACT50485.2020.9268541 SF ELIB - SuUB Bremen
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