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1 Ergebnisse
1
Hybrid Cu-Cu Bonding with Non-Conductive Paste and Highly (..:
, In:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Kuo, Yu-Hao
;
Chen, Chih
- p. 259-261 , 2020
Link:
https://doi.org/10.1109/IMPACT50485.2020.9268547
RT T1 <cTitle>2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Hybrid Cu-Cu Bonding with Non-Conductive Paste and Highly (111)-Oriented Nanotwinned Copper</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9268547&Exemplar=1&LAN=DE A1 Kuo, Yu-Hao A1 Chen, Chih YR 2020 SN 2150-5942 K1 Bonding K1 Films K1 Filling K1 Universal Serial Bus K1 Passivation K1 Copper K1 Thermal stability SP 259 OP 261 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT50485.2020.9268547 DO https://doi.org/10.1109/IMPACT50485.2020.9268547 SF ELIB - SuUB Bremen
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