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1 Ergebnisse
1
Predictive Modelling Methodologies for Bi-material Strip Wa..:
, In:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Wang, Jenn An
;
Eu, Ong. Kang
;
Weng, Wen Hsin
... - p. 72-75 , 2020
Link:
https://doi.org/10.1109/IMPACT50485.2020.9268561
RT T1 <cTitle>2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Predictive Modelling Methodologies for Bi-material Strip Warpage</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9268561&Exemplar=1&LAN=DE A1 Wang, Jenn An A1 Eu, Ong. Kang A1 Weng, Wen Hsin A1 Hsu, Chih Chung A1 Loh, Wei Keat A1 Kulterman, Ron W. A1 Fu, Haley YR 2020 SN 2150-5942 K1 Strips K1 Curing K1 Semiconductor device modeling K1 Temperature K1 Temperature measurement K1 Computational modeling K1 Mathematical model K1 strip warpage K1 simulation K1 assembly process K1 modeling K1 mold flow K1 post mold curing K1 reflow K1 visco-elasticity K1 PVTC K1 bi-material SP 72 OP 75 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT50485.2020.9268561 DO https://doi.org/10.1109/IMPACT50485.2020.9268561 SF ELIB - SuUB Bremen
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