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Using 3D X-ray to detect under-fill (UF) crack of fan-out p..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ke, Chung-Yu ; Zhong, Sung-Hua ; Chen, Liang-Pin - p. 247-248 , 2020
Link: https://doi.org/10.1109/IMPACT50485.2020.9268564