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1 Ergebnisse
1
Single Step Metallization Process for the Filling of Throug..:
, In:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Bellemare, Richard
;
DeSalvo, Don
;
Blake, Ron
.. - p. 188-191 , 2020
Link:
https://doi.org/10.1109/IMPACT50485.2020.9268566
RT T1 <cTitle>2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Single Step Metallization Process for the Filling of Through Holes with Copper</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9268566&Exemplar=1&LAN=DE A1 Bellemare, Richard A1 DeSalvo, Don A1 Blake, Ron A1 Gugliotti, Carmichael A1 Oh, Andy YR 2020 SN 2150-5942 K1 Copper K1 Filling K1 Plating K1 Bridges K1 Thermal conductivity K1 Surface treatment K1 Thermal management SP 188 OP 191 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT50485.2020.9268566 DO https://doi.org/10.1109/IMPACT50485.2020.9268566 SF ELIB - SuUB Bremen
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