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1 Ergebnisse
1
Double-Sided Cooling SiC Power Module Packaging for Industr..:
, In:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Liu, Chun-Kai
;
Wu, Sheng-Tsai
;
Lo, Yuan-Yin
... - p. 105-108 , 2020
Link:
https://doi.org/10.1109/IMPACT50485.2020.9268577
RT T1 <cTitle>2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Double-Sided Cooling SiC Power Module Packaging for Industrial Motor Driving System</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9268577&Exemplar=1&LAN=DE A1 Liu, Chun-Kai A1 Wu, Sheng-Tsai A1 Lo, Yuan-Yin A1 Chiu, Po-Kai A1 Lin, Hsin-Han A1 Chen, Yao-Shun A1 Tzeng, Chih-Ming YR 2020 SN 2150-5942 K1 Multichip modules K1 Cooling K1 Silicon carbide K1 Thermal resistance K1 Wires K1 Bonding K1 Insulated gate bipolar transistors K1 Double sided cooling SiC power module K1 thermal resistance K1 and stray inductance SP 105 OP 108 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT50485.2020.9268577 DO https://doi.org/10.1109/IMPACT50485.2020.9268577 SF ELIB - SuUB Bremen
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