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The development of a new oxide replacement process to meet ..:
, In:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Geibel, Barbara
;
Tang, Felix
;
Thomas, Thomas
... - p. 137-145 , 2020
Link:
https://doi.org/10.1109/IMPACT50485.2020.9268580
RT T1 <cTitle>2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>The development of a new oxide replacement process to meet the high process cleanliness requirements of mSAP Production</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9268580&Exemplar=1&LAN=DE A1 Geibel, Barbara A1 Tang, Felix A1 Thomas, Thomas A1 Michalik, Fabian A1 Gaida, Josef A1 Gil-Ibanez, Belen A1 Zou, Yuan A1 Kim, Ken A1 Huelsmann, Thomas A1 Brooks, Patrick YR 2020 SN 2150-5942 K1 Copper K1 Etching K1 Surface roughness K1 Rough surfaces K1 Surface resistance K1 Loading K1 Thermal expansion SP 137 OP 145 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT50485.2020.9268580 DO https://doi.org/10.1109/IMPACT50485.2020.9268580 SF ELIB - SuUB Bremen
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