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Signal Integrity Improvement on High-Speed Packaging Routin..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Kung, Ming-Lung ; Lin, Yen-Chung ; Cheng, Hung-Hsiang... - p. 270-272 , 2020
Link: https://doi.org/10.1109/IMPACT50485.2020.9268596