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The efficient placement design for 3D Stacked Dies Packages:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Yuan, Zhi-Lung ; Huang, Mong-Na Lo ; Huang, Yu-Jung - p. 262-265 , 2020
Link: https://doi.org/10.1109/IMPACT50485.2020.9268602