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1 Ergebnisse
1
Effects of Isothermal Heat Treatment on Microstructure Evol..:
, In:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Hung, H. T.
;
Yang, S.
;
Shih, P. S.
... - p. 1-5 , 2020
Link:
https://doi.org/10.1109/IMPACT50485.2020.9268611
RT T1 <cTitle>2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9268611&Exemplar=1&LAN=DE A1 Hung, H. T. A1 Yang, S. A1 Shih, P. S. A1 Ma, Z. D. A1 Huang, J. H. A1 Kao, C. R. YR 2020 SN 2150-5942 K1 Nickel K1 Aging K1 Bonding K1 Metals K1 Annealing K1 Microstructure K1 Isothermal processes K1 microfluidic K1 electroless Ni-P plating K1 isothermal heat treatment K1 microstructure evolution SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT50485.2020.9268611 DO https://doi.org/10.1109/IMPACT50485.2020.9268611 SF ELIB - SuUB Bremen
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