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1 Ergebnisse
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Development and Evaluation of High-Density Multi-GPU Sub-Sy..:
, In:
2020 IEEE International Conference on Consumer Electronics - Asia (ICCE-Asia)
,
Kim, Young woo
;
Oh, Myung-hoon
;
Park, Chan-Yeol
- p. 1-4 , 2020
Link:
https://doi.org/10.1109/ICCE-Asia49877.2020.9277195
RT T1
2020 IEEE International Conference on Consumer Electronics - Asia (ICCE-Asia)
: T1
Development and Evaluation of High-Density Multi-GPU Sub-System Using PCI Express Expansion Hardware
UL https://suche.suub.uni-bremen.de/peid=ieee-9277195&Exemplar=1&LAN=DE A1 Kim, Young woo A1 Oh, Myung-hoon A1 Park, Chan-Yeol YR 2020 K1 Graphics processing units K1 Hardware K1 Deep learning K1 Servers K1 Bandwidth K1 Switches K1 Micromechanical devices K1 HPL K1 Multi-GPU K1 OCP K1 Open Rack K1 PCI Express Expansion K1 Resnet50 SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICCE-Asia49877.2020.9277195 DO https://doi.org/10.1109/ICCE-Asia49877.2020.9277195 SF ELIB - SuUB Bremen
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