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1 Ergebnisse
1
Reliability Simulation and Life Prediction of Sn63Pb37 BGA ..:
, In:
2020 China Semiconductor Technology International Conference (CSTIC)
,
Liu, Jiahao
;
He, Liang
;
Chen, Hua
... - p. 1-4 , 2020
Link:
https://doi.org/10.1109/CSTIC49141.2020.9282446
RT T1 <cTitle>2020 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>Reliability Simulation and Life Prediction of Sn63Pb37 BGA Solder Joint Under Thermal Cycling Load</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9282446&Exemplar=1&LAN=DE A1 Liu, Jiahao A1 He, Liang A1 Chen, Hua A1 Zhao, Pan A1 Su, Yahui A1 Chao, Li A1 Pan, Qin YR 2020 K1 Thermal expansion K1 Predictive models K1 Fatigue K1 Thermal loading K1 Soldering K1 Integrated circuit modeling K1 Load modeling SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC49141.2020.9282446 DO https://doi.org/10.1109/CSTIC49141.2020.9282446 SF ELIB - SuUB Bremen
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