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1 Ergebnisse
1
A Promising Embedded Silicon Fan-Out Wafer Level Package wi..:
, In:
2020 China Semiconductor Technology International Conference (CSTIC)
,
Wang, Chengqian
;
Zhang, Aibing
;
Li, Zhengfeng
... - p. 1-4 , 2020
Link:
https://doi.org/10.1109/CSTIC49141.2020.9282470
RT T1
2020 China Semiconductor Technology International Conference (CSTIC)
: T1
A Promising Embedded Silicon Fan-Out Wafer Level Package with Laser Releasable Temporary Bonding Technology
UL https://suche.suub.uni-bremen.de/peid=ieee-9282470&Exemplar=1&LAN=DE A1 Wang, Chengqian A1 Zhang, Aibing A1 Li, Zhengfeng A1 Li, Shouwei A1 Li, Yang A1 Ji, Yong A1 Ming, Xuefei A1 Yu, Daquan YR 2020 K1 Heating systems K1 Scanning electron microscopy K1 Semiconductor lasers K1 Silicon K1 Etching K1 Bonding K1 Substrates SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC49141.2020.9282470 DO https://doi.org/10.1109/CSTIC49141.2020.9282470 SF ELIB - SuUB Bremen
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