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1 Ergebnisse
1
Volume Resistance of Epoxy Molding Compound:
, In:
2020 China Semiconductor Technology International Conference (CSTIC)
,
Liu, Hongjie
;
Tan, Wei
;
Cheng, Xingming
... - p. 1-3 , 2020
Link:
https://doi.org/10.1109/CSTIC49141.2020.9282473
RT T1 <cTitle>2020 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>Volume Resistance of Epoxy Molding Compound</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9282473&Exemplar=1&LAN=DE A1 Liu, Hongjie A1 Tan, Wei A1 Cheng, Xingming A1 Li, Lanxia A1 Duan, Yangyang A1 Fan, Dandan A1 Jiang, Xiaojuan A1 Cui, Liang A1 Han, Jianglong YR 2020 K1 Resistance K1 Performance evaluation K1 Insulation K1 Epoxy resins K1 Ions K1 Market research K1 Compounds SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC49141.2020.9282473 DO https://doi.org/10.1109/CSTIC49141.2020.9282473 SF ELIB - SuUB Bremen
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