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1 Ergebnisse
1
Warpage Control Method in Epoxy Molding Compound:
, In:
2020 China Semiconductor Technology International Conference (CSTIC)
,
Tan, Wei
;
Cheng, Cheng
;
Liu, Hongjie
... - p. 1-3 , 2020
Link:
https://doi.org/10.1109/CSTIC49141.2020.9282577
RT T1 <cTitle>2020 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>Warpage Control Method in Epoxy Molding Compound</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9282577&Exemplar=1&LAN=DE A1 Tan, Wei A1 Cheng, Cheng A1 Liu, Hongjie A1 Duan, Yangyang A1 Liu, Linlin A1 Cheng, Xingming A1 Li, Lanxia YR 2020 K1 Loading K1 Process control K1 Packaging K1 Electromagnetic compatibility K1 Compounds K1 Stress K1 Substrates K1 Epoxy molding compound K1 Warpage K1 Glass transition K1 CTE SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC49141.2020.9282577 DO https://doi.org/10.1109/CSTIC49141.2020.9282577 SF ELIB - SuUB Bremen
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