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1 Ergebnisse
1
Comprehensive Comparison of the Wire Bond Reliability Perfo..:
, In:
2020 China Semiconductor Technology International Conference (CSTIC)
,
Lois, Liao Jinzhi
;
Minglang, Yu
;
Weikok, Tee
... - p. 1-5 , 2020
Link:
https://doi.org/10.1109/CSTIC49141.2020.9282593
RT T1 <cTitle>2020 China Semiconductor Technology International Conference (CSTIC)</cTitle>: T1 <Title>Comprehensive Comparison of the Wire Bond Reliability Performance of CU, PDCU and AG Wires</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9282593&Exemplar=1&LAN=DE A1 Lois, Liao Jinzhi A1 Minglang, Yu A1 Weikok, Tee A1 Bisheng, Wang A1 Wenping, Jia A1 Boonhwa, Yee A1 Haipeng, Zheng A1 Xi, Zhang A1 Chao, Fu A1 Xiaomin, Li A1 Younan, Hua YR 2020 K1 Performance evaluation K1 Corrosion K1 Wires K1 Chlorine K1 Life estimation K1 Electromagnetic compatibility K1 Reliability SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC49141.2020.9282593 DO https://doi.org/10.1109/CSTIC49141.2020.9282593 SF ELIB - SuUB Bremen
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