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1 Ergebnisse
1
Silicon vs. Organic Interposer: PPA and Reliability Tradeof..:
, In:
2020 IEEE 38th International Conference on Computer Design (ICCD)
,
Kim, Jinwoo
;
Krishna Chekuri, Venkata Chaitanya
;
Rahman, Nael Mizanur
... - p. 80-87 , 2020
Link:
https://doi.org/10.1109/ICCD50377.2020.00030
RT T1
2020 IEEE 38th International Conference on Computer Design (ICCD)
: T1
Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration
UL https://suche.suub.uni-bremen.de/peid=ieee-9283591&Exemplar=1&LAN=DE A1 Kim, Jinwoo A1 Krishna Chekuri, Venkata Chaitanya A1 Rahman, Nael Mizanur A1 Dolatsara, Majid Ahadi A1 Torun, Hakki A1 Swaminathan, Madhavan A1 Mukhopadhyay, Saibal A1 Kyu Lim, Sung YR 2020 SN 2576-6996 K1 Reliability engineering K1 Silicon K1 Power system reliability K1 Delays K1 Impedance K1 Cost benefit analysis K1 Substrates K1 2.5D IC K1 silicon interposer K1 liquid crystal polymer (LCP) K1 tradeoff K1 PPA K1 signal and power integrity SP 80 OP 87 LK http://dx.doi.org/https://doi.org/10.1109/ICCD50377.2020.00030 DO https://doi.org/10.1109/ICCD50377.2020.00030 SF ELIB - SuUB Bremen
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