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1
Development and Test of a Data Framework for Prediction of ..:
, In:
2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)
,
Seidel, Reinhardt
;
Thielen, Nils
;
Schmidt, Konstantin
.. - p. 250-255 , 2020
Link:
https://doi.org/10.1109/SIITME50350.2020.9292175
RT T1 <cTitle>2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)</cTitle>: T1 <Title>Development and Test of a Data Framework for Prediction of Soldering Quality in Selective Wave Soldering Applying K-Nearest Neighbors</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9292175&Exemplar=1&LAN=DE A1 Seidel, Reinhardt A1 Thielen, Nils A1 Schmidt, Konstantin A1 Voigt, Christian A1 Franke, Jorg YR 2020 SN 2642-7036 K1 Soldering K1 Copper K1 Printed circuits K1 Pins K1 Thermal resistance K1 Electronic packaging thermal management K1 Machine learning K1 Mini wave soldering K1 Solder rise K1 Grey box K1 Hybrid modeling K1 Data mining K1 Smart electronics production SP 250 OP 255 LK http://dx.doi.org/https://doi.org/10.1109/SIITME50350.2020.9292175 DO https://doi.org/10.1109/SIITME50350.2020.9292175 SF ELIB - SuUB Bremen
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