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1
Enhanced X-Ray Inspection of Solder Joints in SMT Electroni..:
, In:
2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)
,
Schmidt, Konstantin
;
Thielen, Nils
;
Voigt, Christian
... - p. 26-31 , 2020
Link:
https://doi.org/10.1109/SIITME50350.2020.9292292
RT T1 <cTitle>2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)</cTitle>: T1 <Title>Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9292292&Exemplar=1&LAN=DE A1 Schmidt, Konstantin A1 Thielen, Nils A1 Voigt, Christian A1 Seidel, Reinhardt A1 Franke, Jorg A1 Milde, Yannik A1 Bonig, Jochen A1 Beitinger, Gunter YR 2020 SN 2642-7036 K1 Inspection K1 Training K1 Soldering K1 X-ray imaging K1 Production K1 Image classification K1 Object detection K1 electronics production K1 automated X-ray inspection K1 machine learning K1 computervision K1 Convolutional Neural Networks SP 26 OP 31 LK http://dx.doi.org/https://doi.org/10.1109/SIITME50350.2020.9292292 DO https://doi.org/10.1109/SIITME50350.2020.9292292 SF ELIB - SuUB Bremen
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