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1 Ergebnisse
1
Analysis on the Reliability Effect of Solder Voids on the N..:
, In:
2020 4th International Conference on HVDC (HVDC)
,
Renkuan, Liu
;
Hul, Li
;
Haiyang, Long
... - p. 20-25 , 2020
Link:
https://doi.org/10.1109/HVDC50696.2020.9292846
RT T1 <cTitle>2020 4th International Conference on HVDC (HVDC)</cTitle>: T1 <Title>Analysis on the Reliability Effect of Solder Voids on the Nanosilver Sintered Press-Pack IGBT</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9292846&Exemplar=1&LAN=DE A1 Renkuan, Liu A1 Hul, Li A1 Haiyang, Long A1 Wei, Lai A1 Xiao, Wang A1 Ran, Yao A1 Renze, Yu A1 Yue, Yu YR 2020 K1 Insulated gate bipolar transistors K1 Stress K1 Temperature distribution K1 Strain K1 Junctions K1 Finite element analysis K1 Simulation K1 solder voids K1 nanosliver sintering package K1 presspack IGBT K1 reliability SP 20 OP 25 LK http://dx.doi.org/https://doi.org/10.1109/HVDC50696.2020.9292846 DO https://doi.org/10.1109/HVDC50696.2020.9292846 SF ELIB - SuUB Bremen
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