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1 Ergebnisse
1
Environmental Influence on Fracture and Delamination of Ele..:
, In:
2020 47th IEEE Photovoltaic Specialists Conference (PVSC)
,
Springer, Martin
;
Bosco, Nick
- p. 1110-1113 , 2020
Link:
https://doi.org/10.1109/PVSC45281.2020.9300480
RT T1 <cTitle>2020 47th IEEE Photovoltaic Specialists Conference (PVSC)</cTitle>: T1 <Title>Environmental Influence on Fracture and Delamination of Electrically Conductive Adhesives</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9300480&Exemplar=1&LAN=DE A1 Springer, Martin A1 Bosco, Nick YR 2020 K1 Temperature measurement K1 Humidity K1 Integrated circuits K1 Force K1 Energy measurement K1 Humidity measurement K1 Conductive adhesives K1 electrically conductive adhesives K1 photovoltaic K1 debonding K1 fracture mechanics K1 environmental conditions SP 1110 OP 1113 LK http://dx.doi.org/https://doi.org/10.1109/PVSC45281.2020.9300480 DO https://doi.org/10.1109/PVSC45281.2020.9300480 SF ELIB - SuUB Bremen
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